NeuCool technology works with existing data center equipment and configuration. Credit: Chepko Danil Vitalevich / Shutterstock Accelsius, a relative newcomer in the liquid cooling market, has launched its NeuCool dual-phase, direct-to-chip liquid cooling technology, which is designed to be deployed without having to do a massive retrofit of your data center. Liquid cooling is a growing technology to address rising heat density in data centers – which traditional fans simply can’t handle anymore. Liquid cooling offers 3,000 times the heat absorption of air, but to roll it out in a data center requires either a massive retrofit, or building a whole new facility from scratch to handle things like piping and special equipment. NeuCool fits into traditional racks ranging from the standard 42U size to more than 50U with no special rack mounting required. It especially benefits older systems, since most new servers being introduced into data centers today are preconfigured for deployment, and more and more are being sold with liquid cooling connectors. For older air-cooled systems, the heat sinks and fans are replaced by NeuCool CPU and GPU Vaporators, which affix to the same location and footprint as the heat sinks and fans. The plumbing for vapor and liquid dielectric is also predetermined and integrated in advance. So, the new NeuCool Vaporators are integrated and validated prior to server deployments. The vaporators (also called cold plates) are mounted directly to targeted hot-spot chips. An eco-friendly dielectric refrigerant is used to draw heat away from the chip, where it turns into a vapor. That vapor then travels through an industrial manifold to an intelligent Platform Control Unit (iPCU), condensing back into a liquid in a closed-loop system and returning to the vaporator for continued cooling. The NeuCool architecture is heavily engineered to prevent leakage, which is a fear many people have when it comes to adopting liquid cooling. NeuCool’s modular design enables seamless integration into existing data center facilities and at the edge via water-cooled doors, dry coolers or other heat rejection methods. Accelsius claims that its NeuCool two-phase, direct-to-chip, in-rack solution offers a solution for cooling challenges with an estimated 50% savings in energy costs, an 80% reduction in CO2 emissions, and zero water used when compared to air cooling. The company is taking orders now, with deployments planned to begin later this month. Related content news AMD holds steady against Intel in Q1 x86 processor shipments finally realigned with typical seasonal trends for client and server processors, according to Mercury Research. By Andy Patrizio May 22, 2024 4 mins CPUs and Processors Data Center news Broadcom launches 400G Ethernet adapters The highly scalable, low-power 400G PCIe Gen 5.0 Ethernet adapters are designed for AI in the data center. By Andy Patrizio May 21, 2024 3 mins CPUs and Processors Networking news HPE updates block storage services The company adds new storage controller support as well as AWS. By Andy Patrizio May 20, 2024 3 mins Enterprise Storage Data Center news ZutaCore launches liquid cooling for advanced Nvidia chips The HyperCool direct-to-chip system from ZutaCore is designed to cool up to 120kW of rack power without requiring a facilities modification. By Andy Patrizio May 15, 2024 3 mins Servers Data Center PODCASTS VIDEOS RESOURCES EVENTS NEWSLETTERS Newsletter Promo Module Test Description for newsletter promo module. Please enter a valid email address Subscribe